某電子設備的熱分析

2012年12月艦船電子對抗)ec.2012第35卷第6期SHIPBOARD ELECTRONIC COUNTERMEASUREVol 35 No 6某電子設備的熱分析董智鼎,李龍(船舶重工集團公司723所,揚州225001)摘要:熱設計在電子設備結構設計中是十分重要的環(huán)節,對提高電子產(chǎn)品的運行穩定性具有重要的意義。通過(guò)Icepak軟件對某電子設備進(jìn)行熱仿真分析,得到了發(fā)熱器件的溫度分布云圖。在此基礎上,通過(guò)改進(jìn)方案,將器件最高溫度控制在耐受溫度以下。利用熱仿真軟件可以及時(shí)發(fā)現方案中所存在的問(wèn)題,在提升設備品質(zhì)性能的同時(shí),縮短了設備的研發(fā)周期。關(guān)鍵詞:熱分析;pak軟件;電子設備中圖分類(lèi)號:TNo3文獻標識碼:A文章編號:CN32-1413(2012)060107-03Thermal Analysis of A Certain Electronic EquipmentDONG Zhi-ding, LI Long(The 723 Institute of CSIC, Yangzhou 225001, China)Abstract: The thermal design is a very important tache in the structure design of electronic equipments, and has important meaning to raise the operation stability of the electronic products. Thispaper performs the thermal simulation analysis to a certain electronic equipment through Icepaksoftware, fetches the temperature distribution cloud figure of heat devices, based on which, themaximum temperature of devices is controlled below the tolerance temperature through improvingprogram. The usage of thermal simulation software can find the problems in the program, whichimproves the quality and performance of equipments as well as shortens the development period ofequipments at the same time.Key words: thermal analysis; Icepak software; electronic equipment0引言1物理模型隨著(zhù)電子封裝技術(shù)水平的不斷提高,電子產(chǎn)品發(fā)熱器件分布在印制板上,總發(fā)熱功率為的外形尺寸越來(lái)越小,單位熱流密度也迅速增大。23W,環(huán)境溫度62℃,高溫試驗2h,器件最高耐受尋找一條低熱阻的通道將熱量有效地傳導出去,避溫度85℃。設備外形尺寸為:長(cháng)150mm,寬100免積聚則尤為重要1。電子設備熱設計是十分必要mm,高31mm。印制板沿長(cháng)度方向水平安裝在設的環(huán)節,研究散熱方法,改善散熱方式,提高冷卻效備內,如圖1所示果,對提高電子產(chǎn)品的運行穩定性具有十分重要的意義[2)。利用計算機仿真技術(shù),應用專(zhuān)業(yè)仿真軟件進(jìn)行的熱設計及熱分析,可大大減少計算量,縮短研制周期,降低開(kāi)發(fā)成本,避免傳統分析時(shí)的大量公式計算。文中根據工程實(shí)際,利用 Icepak軟件對某電中國煤化工子設備進(jìn)行熱分析,詳細介紹了利用 Icepak軟件進(jìn)THCNMHG行熱設計仿真的過(guò)程3發(fā)熱器件的上表面與安裝面緊貼,為了降低發(fā)收稿日期:2012-07-01中國煤化工CNMHG中國煤化工CNMHG