IEC 62047-37-2020 半導體設備--微機電設備--第37部分:傳感器用MEMS壓電薄膜的環(huán)境試驗方法 Semiconductor devices – Micro-electromechanical devices – Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.
This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.dition 1.0 2020-04 INTERNATIONAL STANDARD NORME INTERNATIONALE colour inside Semiconductor devices – Micro-electromechanical devices – Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application Dispositifs à semiconducteurs – Dispositifs microélectromécaniques – Partie 37: Méthodes d’essai d’environnement des couches minces piézoélectriques MEMS pour les applications de type capteur IEC 62047-37:2020-04(en-