IEC TS 62647-3-2014 航空電子設備用流程管理--含無(wú)鉛焊料的航空航天和防御電子系統--第3部分: 包含無(wú)鉛焊料和加工系統的性能試驗 Process management for avionics -- Aerospace and defence electronic systems containing lead-free solder -- Part 3: Performance testing for systems containing lead-free solder and f

This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. This specification aims to communicate requirements for a lead-free control plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan owners in the development of their own Plans. The Plan documents the Plan owner’s processes to assure their customers and all other stakeholders that the Plan owner’s products will continue to meet their requirements, given the risks stated in the Introduction. This specification does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that need to be addressed by the processes. Pb-free risk management should be accomplished through specific requirements added to the Plan owner’s existing infrastructure of product management and control. This specification applies to the ADHP electronics system supply chain. The control of the Pb-free activities will be accomplished by the Plan owner addressing the requirements of their Customer. These activities include, but are not limited to, those performed by the system integrator, the original equipment manufacturer (OEM), and their respective supply chains, to the lowest level possible. This should be done with the knowledge that, at the component level, the aerospace industry may not have a great influence over those suppliers. In such cases, the Plan owner assumes responsibility. Some applications may have unique requirements that exceed the scope of this specification. The extended scope should be covered separately. The requirements of this specification may be tailored to address unique/specific program needs. If tailoring is performed, the user will obtain documented customer concurrence. Annex A provides a tailoring template that may be used. This document may be used by other high-performance and high-reliability industries, at their discretion.dition 1.0 2014-02 TECHNICAL SPECIFICATION colour inside Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 3: Performance testing for systems containing lead-free solder and finishes IEC TS 62647-3:2014-02(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ？ 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified